Transient of thermal stresses in printed circuit boards

Šuba, Oldřich; Sýkorová, Libuše

dc.title	Transient of thermal stresses in printed circuit boards	en
dc.contributor.author	Šuba, Oldřich
dc.contributor.author	Sýkorová, Libuše
dc.relation.ispartof	International Journal of Mechanics
dc.identifier.issn	1998-4448 Scopus Sources, Sherpa/RoMEO, JCR
dc.date.issued	2011
utb.relation.volume	5
utb.relation.issue	3
dc.citation.spage	226
dc.citation.epage	233
dc.type	article
dc.language.iso	en
dc.relation.uri	http://www.naun.org/multimedia/NAUN/mechanics/20-861.pdf
dc.subject	Layered walls	en
dc.subject	Printed circuit boards	en
dc.subject	Thermal stress	en
utb.faculty	Faculty of Technology
dc.identifier.uri	http://hdl.handle.net/10563/1002302
utb.identifier.rivid	RIV/70883521:28110/11:43865257!RIV12-MSM-28110___
utb.identifier.obdid	43865259
utb.identifier.scopus	2-s2.0-79960054874
utb.source	j-scopus
dc.date.accessioned	2011-09-30T00:09:47Z
dc.date.available	2011-09-30T00:09:47Z
utb.contributor.internalauthor	Šuba, Oldřich
utb.contributor.internalauthor	Sýkorová, Libuše