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Vibroacoustics of the heat pump housing and sound propagation through the surrounding area

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dc.title Vibroacoustics of the heat pump housing and sound propagation through the surrounding area en
dc.contributor.author Drábek, Pavel
dc.relation.ispartof Proceedings - 26th International Conference on Circuits, Systems, Communications and Computers, CSCC 2022
dc.identifier.isbn 978-1-6654-8186-1
dc.date.issued 2022
dc.citation.spage 67
dc.citation.epage 71
dc.event.title 26th International Conference on Circuits, Systems, Communications and Computers, CSCC 2022
dc.event.location Chania, Crete Island
utb.event.state-en Greece
utb.event.state-cs Řecko
dc.event.sdate 2022-07-19
dc.event.edate 2022-07-22
dc.type conferenceObject
dc.language.iso en
dc.publisher Institute of Electrical and Electronics Engineers Inc.
dc.identifier.doi 10.1109/CSCC55931.2022.00022
dc.relation.uri https://ieeexplore.ieee.org/document/10017984
dc.relation.uri https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10017984
dc.subject harmonic acoustics en
dc.subject harmonic analysis en
dc.subject heat pump en
dc.subject modal analysis en
dc.subject sound composer en
dc.subject vibroacoustics en
dc.description.abstract Acoustics is a discipline that has been discussed in more and more sectors over the years. This trend is very closely linked to the current trends in the manufacturing industry to lighten materials, which has a negative impact on the ability to dampen sound [1]. Noise requirements come from the customer and are reflected in the various noise regulations that manufacturers try to meet with their products. Of particular importance are devices which perform reciprocating or rotary motion and are located in the protected space of buildings. A good example is an air-to-water/air-to-air heat pump, which is a device that operates for a significant part of the day. This paper discusses the individual stages of the analysis leading to the determination of the noise at the listener's location and addressing the effect of structure-born noise on the overall sound of the device. A simple model of a heat pump housing was used as an example. © 2022 IEEE. en
utb.faculty Faculty of Applied Informatics
dc.identifier.uri http://hdl.handle.net/10563/1011397
utb.identifier.obdid 43884315
utb.identifier.scopus 2-s2.0-85147736558
utb.source d-scopus
dc.date.accessioned 2023-02-25T13:54:20Z
dc.date.available 2023-02-25T13:54:20Z
utb.ou CEBIA-Tech
utb.contributor.internalauthor Drábek, Pavel
utb.fulltext.sponsorship This publication was supported by the European Structural and Investment Funds, Operational Programme Research, Development and Education under the project The Development of Capacity for Research and Development of TBU in Zlín, reg. no. CZ.02.2.69/0.0/0.0/16_028/0006243.
utb.scopus.affiliation Regional Research Centre CEBIA-Tech, Tomas Bata University in Zlín, Zlin, Czech Republic
utb.fulltext.projects CZ.02.2.69/0.0/0.0/16_028/0006243
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