Separation of printed circuit board by temperature shock

Abstract

In this contribution we are dealing with the possibility of electronic waste separation by temperature effect. It gives a possible direction how to solve the problem of increasing with of heat transfer inside the printed circuit boards (PCB) and with thermal longitudinal expansion of used material in the FEMLAB software environment. The problem is modeled also in other programs, which offer the view of the whole structure of used materials and subsequently their movement in dependence on changes of the ambient temperature. With the use of the utilize experience from detail references background research and various software simulators we achieved the maximum analysis of the problem. The solving, which resulted from the calculations of shear stress of given materials was subsequently verified in laboratory. The development of new criteria for PCB recycling has opened new possibilites of treatment for used materials.