Kontaktujte nás | Jazyk: čeština English
Název: | Characterization of ultra-thin tungsten layers | ||||||||||
Autor: | Martínek, Tomáš; Kudělka, Josef; Navrátil, Milan; Fořt, Tomáš; Křesálek, Vojtěch | ||||||||||
Typ dokumentu: | Recenzovaný odborný článek (English) | ||||||||||
Zdrojový dok.: | International Journal of Applied Engineering Research. 2016, vol. 11, issue 11, p. 7523-7525 | ||||||||||
ISSN: | 0973-4562 (Sherpa/RoMEO, JCR) | ||||||||||
Journal Impact
This chart shows the development of journal-level impact metrics in time
|
|||||||||||
Abstrakt: | Atomic force microscopy and surface resistivity measurement were used for characterization of ultra-thin tungsten layers deposited on purified silicon with 200 nm thermic silicon dioxide substrate. Radio-frequency magnetron sputtering was used for tungsten deposition. © Research India Publications. | ||||||||||
Plný text: | https://www.ripublication.com/Volume/ijaerv11n11.htm | ||||||||||
Zobrazit celý záznam |